Application Oriented Digital Leap Packages
The Application Oriented Digital Leap packages lead you to the next steps once the foundation is laid with Basic Digital Leap packages. The package comprises of hardware and software which provides customized automation packages that will enable customers to address various manufacturing challenges: reduce time-to-market, enhance flexibility, increase quality and efficiency with improved security.
The foundation of the Digital Leap initiative is the industry leading Totally Integrated Automation (TIA) Platform from Siemens. TIA Portal enables access to the entire digitalized automation – from planning and engineering to operation. The bottom line: less complexity resulting in shorter time-to-market, transparent processes, and maximum productivity.
Target Audience: The packages can be utilized by various industries/OEMs who engage in their own engineering set up including:
- Machine Building
- Food & Beverage
- Water & Wastewater
- and many more.
With simple integration into plants, production lines and machines, Package 4 enables to turn a smartwatch into a messaging service device for production: Depending on the configuration, the Notifier automatically informs of important messages from the automation systems. With the offerings of Package 4, one can react quickly and specifically to problems and malfunctions and thereby increase the availability and productivity of the plant. The reduced downtimes result in considerable time and cost savings. The benefits of Package 7 are:
- Direct notifications on smartwatch, smartphone, and tablet
- Fast reaction times in case of service calls or machine failures
- Reduce downtime by recognition and localization of plant or machine failure
- Easy integration
- Increased mobility and reachability of employees through communication via WiFi
Machine development is usually sequential. Mechanical design, electrical design and automation are performed one after the other. If any mistake is made anywhere in the development process and goes undetected, then the cost of error grows by a factor of ten per phase of development. Undetected errors can cause expensive damage during commissioning.
Package 5 lets one place a machine in the TIA Portal, virtually. Based on the Digital Twin of the new machine; the mechanical design, electrical design and automation engineering can be performed in parallel. Simulations and tests discover faults at an early stage, thus helping fast on-site commissioning at the customer site with less risk. This enables reduced time to market, lowers cost, increases flexibility and productivity. With Simulation Kit package, it is possible to simulate and optimize the interaction between individual components of entire production lines in a virtual environment. The benefits of Package 8 are:
- Reduced commissioning time by virtual copy of automation project
- Perform comprehensive tests of automation applications
- Provide a realistic training environment even before the real startup
- Create opportunities for process optimization
- Ensure security with integrated electronic authorization management
Package 5 offers the option to generate the physical and kinematic model of mechanical components with Mechatronics Concept designer NXMCD. You may avail the same at attractive prices. Contact our local sales for the prices.
For more information on Package 5:
Running work processes in parallel using integrated Digitalization promises huge gains in time allowing one to handle the increasing complex applications, to respond quickly to constantly changing customer demands and guarantee consistent top quality in the development process. With this package one can save valuable time and achieve engineering efficiencies upto 30% by automating engineering processes, eliminating sources of defect and easily standardizing common functions. Package 6 helps you to:
- Shorten time to market with TIA portal libraries
- Coordinate work with multiuser engineering
- Save engineering time with openness scripter
- Integrate to higher-level systems with OPC UA