Visit us at PACK EXPO International 2019, Sept. 23-25

Visit booth LS-6567 to learn about Siemens solutions for the packaging industry at PACK EXPO International, the largest packaging trade show in the world.  Experience our end-to-end digitalization solutions and learn how to become more agile to rapidly adapt to market change.

Powering rapid and agile response to market change

Don't miss our two dynamic Innovation stage presentations

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Presentation: How the Digital Twin Greatly Improves Automation Efficiencies 

Tuesday, Sept 24 at 3:00 PM
Innovation Stage 3

Learn how a digital twin can save you time commissioning your packaging machine virtually before building the real machine. A control engineer can work in parallel with his mechanical colleague much sooner in the process, allowing both to verify the sequence of operations and fault handling before the machine is even built. This results in a faster time to market and a better quality machine. In addition, a digital twin allows for virtual training for the machine operator, and critically can also help in the sales and promotion of a machine to the end customer, as they know exactly what they will be receiving.

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Presentation: Bridging Packaging Machine Design and Manufacturing through Digitalization

Wednesday, Sept 25 at 11:00 AM
Innovation Stage 3

Advancements in digital technology in industry has resulted in new offerings from machine builders and new capabilities needed by manufacturers. In this interactive presentation, learn how both can digitally collaborate to realize these new advances and bring innovation to life faster. Technologies, like the digital twin of the machine offer a unique bridge between packaging machine builders and the manufacturers, providing value in the design, commissioning and operation of the machine. This session will highlight the collaboration potential, new business models, as well as live demonstrations.

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See what to expect!

A look at the technology and solutions Siemens will present at PACK EXPO 2019